MAIN PRODUCTION
LASER CUT STENCIL
Laser-cut is a subtractive process. The Gerber data is translated into a CNC-type language that the laser understands. The aperture is cut out by moving the laser head only, moving the table holding the stencil only or a combination of each. The laser beam enters inside the aperture boundary and traverses to the perimeter where it completely cuts the aperture out of the metal, one aperture at a time.
Keywords
Laser Cut Stencil
LPKF Laser cutting system
IPC-7525
More Info
LPKF Laser cutting system provide faster initial piercing times, quicker straight-line cutting and a smoother cutting surface and edge finish while cutting materials maximum thickness till 23mil. The smoothness of cut also depends on many parameters, including cut speed, beam spot size, laser power and beam focus. The laser can cut to very accurate aperture sizes over a wide range of size and shape requirements.
General guidelines for stencil may be vary by resource. The “official” IPC-7525 specification offers a method of calculating the required aperture zone to optimize print quality. Very often, the PCB layout itself precludes the use of optimally designed aperture zones; therefore, alternate guidance has been developed.