HIGH QUALITY STENCIL
STEP STENCIL
Numerous SMD applications require a large number of very different components on a circuit board and therefore different quantities of solder paste have to be applied in one printing pass. These differences in solder paste requirements can no longer be leveled out by the pad geometry and size of the apertures alone; what they need are stencils which have partial or local steps in thickness. They are called step, step-up/step down or multi-level stencils
Keywords
– Step-Down Stencil
– Step-Up Stencil
– Multi-Level Step Stencil
More Info
- Step-Down Stencil :
Reducing the thickness of certain area in stencil to lessen the Tin volume of specified components in soldering process, and no affection of stencil cleaning. This step-down stencil will be helpful to solve printing defect for special bump (such as with label) of PCB.
- Step-Up Stencil :
Increasing the thickness of certain area in stencil to add Tin volume for designed components in population process, and it is especially suitable for through hole reflow solder artwork (such as plug-in, Dip components reflow solder).
- Multi-Level step stencil :
Reducing and increasing the thickness of stencil for certain area, on the same stencil. It means there are three different thicknesses in the same stencil, to meet different requirements of Tin volume.