Electroform Stencil (E-FORM)

Electroform technology delivers ultimate control over stencil thickness and uniformity, ensuring outstanding paste volume consistency for fine pitch applications. Electroform stencils provide superior performance and ensure seal contact to the pad, pad paste deposit and a greater percentage volume of paste on pad. Electroform stencils are very effective for printing paste on SMT boards with fine pitch parts spread over a large area and provide excellent print performance for applications with miniature BGAs, ultrafine pitch QFPs and small components such as 0201.